Wide-Temperature Radiation-Hardened Interface Chipsets Utilizing Delay-Insensitive Asynchronous Logic, Phase I

Metadata Updated: November 12, 2020

There is a continual drive to move electronics out of the "warm box" to their point of use on space platforms. This requires electronics that can operate reliably over a wide range of temperatures and in the presence of radiation.

Access & Use Information

Public: This dataset is intended for public access and use. License: No license information was provided. If this work was prepared by an officer or employee of the United States government as part of that person's official duties it is considered a U.S. Government Work.

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Dates

Metadata Created Date November 12, 2020
Metadata Updated Date November 12, 2020

Metadata Source

Harvested from NASA Data.json

Additional Metadata

Resource Type Dataset
Metadata Created Date November 12, 2020
Metadata Updated Date November 12, 2020
Publisher Space Technology Mission Directorate
Unique Identifier Unknown
Maintainer
Identifier TECHPORT_9211
Data First Published 2012-08-01
Data Last Modified 2020-01-29
Public Access Level public
Bureau Code 026:00
Metadata Context https://project-open-data.cio.gov/v1.1/schema/catalog.jsonld
Metadata Catalog ID https://data.nasa.gov/data.json
Schema Version https://project-open-data.cio.gov/v1.1/schema
Catalog Describedby https://project-open-data.cio.gov/v1.1/schema/catalog.json
Homepage URL https://techport.nasa.gov/view/9211
Program Code 026:027
Source Datajson Identifier True
Source Hash eb3d71df1b6540f8ff314fd75b6a71cf0fe6f4ac
Source Schema Version 1.1

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